发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device includes a first semiconductor layer, a second semiconductor layer of a second conductivity type formed on the first semiconductor layer, a first electrode which extends in a first direction and is surrounded by the first semiconductor layer except at one end thereof, and a first insulation film which is formed between the first semiconductor layer and the first electrode. A film thickness of the first insulation film between the other end of the first electrode in a second direction opposite to the first direction and the first semiconductor layer includes a thickness that is greater than a thickness of the first insulation film along a side surface of the first electrode. The semiconductor device also includes a second electrode which faces the second semiconductor layer, and a second insulation film which is formed between the second electrode and the second semiconductor layer.
申请公布号 US2014284773(A1) 申请公布日期 2014.09.25
申请号 US201314016181 申请日期 2013.09.02
申请人 Kabushiki Kaisha Toshiba 发明人 NISHIGUCHI Toshifumi
分类号 H01L29/51;H01L21/28 主分类号 H01L29/51
代理机构 代理人
主权项 1. A semiconductor device comprising: a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type formed on the first semiconductor layer; a first electrode extending in a first direction toward the second semiconductor layer away from the first semiconductor layer and which is surrounded by the first semiconductor layer except at one end thereof; and a first insulation film which is formed between the first semiconductor layer and the first electrode, the first insulation film having a film thickness at the other end of the first electrode that is greater than a thickness along a side surface thereof as the first insulation film approaches the one end of the first electrode; a second electrode which is formed on the end of the first insulation film in the first direction and faces the second semiconductor layer; a second insulation film which is formed between the second electrode and the second semiconductor layer and has a thickness that is less than the thickness of the first insulation film; and a third insulation film formed between the first electrode and the second electrode.
地址 Tokyo JP