发明名称 BONDING TRANSISTOR WAFER TO LED WAFER TO FORM ACTIVE LED MODULES
摘要 LED modules are disclosed having a control MOSFET, or other transistor, in series with an LED. In one embodiment, a MOSFET wafer, containing an array of vertical MOSFETS, is aligned and bonded to an LED wafer, containing a corresponding array of vertical LEDs, and singulated to form thousands of active 3-terminal LED modules with the same footprint as a single LED. Despite the different forward voltages of red, green, and blue LEDs, RGB modules may be connected in parallel and their control voltages staggered at 60 Hz or greater to generate a single perceived color, such as white. The RGB modules may be connected in a panel for general illumination or for a color display.
申请公布号 WO2014151661(A2) 申请公布日期 2014.09.25
申请号 WO2014US26200 申请日期 2014.03.13
申请人 NTHDEGREE TECHNOLOGIES WORLDWIDE INC. 发明人 ORAW, BRADLEY S.
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