发明名称 |
EMBEDDED METAL STRUCTURES IN CERAMIC SUBSTRATES |
摘要 |
<p>The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations, in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three-dimensional, i.e. curved or angular, substrates in addition to the two-dimensional flat and level, i.e. plate-shaped, substrates. According to the invention, this is achieved in that trenches and/or recesses are dug into the substrate using laser technology, and the metal structures are then produced in the trenches and/or recesses.</p> |
申请公布号 |
EP2781143(A1) |
申请公布日期 |
2014.09.24 |
申请号 |
EP20120787011 |
申请日期 |
2012.11.16 |
申请人 |
CERAMTEC GMBH |
发明人 |
DOHN, ALEXANDER;HERRMANN, KLAUS;THIMM, ALFRED;HELGERT, OSKAR;LENEIS, ROLAND;ADLER, SIGURD |
分类号 |
H05K3/10;H05K1/02;H05K3/18 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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