A PREPROCESSING METHOD OF ELECTRONIC COPPER-PLATING USING IONIC CONDUTING NANO POLYMER TO ALTERNATE A PROCESS OF ELECTROLESS COPPER-PLATING AND RAW MATERIAL FOR ELECTRONIC COPPER PLATING OF COPPER LAMINATE OF PLASTIC CIRCUIT BOARD

摘要

A pretreatment method of an electro copper plating process using a conductive nanopolymer capable of replacing an electroless copper plating process, and a pretreating material for the electro copper plating process of a PCB material according to the present invention can reduce a pretreatment process for an electro copper plating process using a conductive nanopolymer, can prevent environmental pollution, and can drastically reduce costs.