| 摘要 |
A chip apparatus may include: a first semiconductor chip having a first side and a second side opposite to the first side; a second semiconductor chip having a first side and a second side opposite to the first side, wherein the second semiconductor chip is disposed at the first side of the first semiconductor chip and electrically coupled to the first semiconductor chip, and the first side of the second semiconductor chip faces the first side of the first semiconductor chip; an encapsulation layer at least partially encapsulating the first semiconductor chip and the second semiconductor chip, wherein the encapsulation layer has a first side and a second side opposite to the first side, and the second side is aligned in the same direction as the second side of the second semiconductor chip; and an interconnection structure disposed at least partially within the encapsulation layer and electrically coupled to at least one of the first and second semiconductor chips, wherein the interconnection structure may extend to the second side of the encapsulation layer. |
