METHODS FOR PRODUCING INTERCONNECTS IN SEMICONDUCTOR DEVICES

摘要

A method for producing interconnects on a workpiece includes the following steps: preparing a substrate having a feature as a workpiece; depositing a conductive layer in the feature to fill the feature in part or in whole; depositing a copper fill to completely fill the feature if the feature is partially filled with the conductive layer; applying a copper overburden; thermally treating the workpiece; and removing the overburden to expose the substrate and the metalized feature.