发明名称
摘要 PROBLEM TO BE SOLVED: To provide a positive resist composition and a pattern forming method using the positive resist composition excellent in performance of a profile shape, pattern collapse and exposure latitude even in forming a fine pattern of 100 nm or less in patterning by normal exposure (dry exposure), and also excellent in patterning by liquid immersion exposure.SOLUTION: A positive resist composition and a pattern forming method using the positive resist composition contain: (a) resin in which solubility for alkali developing solution increases by action of acid, (B) a compound which generates the acid by irradiation of active rays or radiation rays; and (c) an amine compound comprising structure with an ester bond bonded to a nitrogen atom.
申请公布号 JP5593357(B2) 申请公布日期 2014.09.24
申请号 JP20120205003 申请日期 2012.09.18
申请人 发明人
分类号 G03F7/039;G03F7/004 主分类号 G03F7/039
代理机构 代理人
主权项
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