METHOD OF MANUFACTURING HIGH-PERFORMANCE PRINTED CIRCUIT BOARD

摘要

In the present invention, an epoxy resin is stacked and laminated on one side of a board and completely cured to a C stage, to fix parts mounted inside a cavity. Then, the present invention is characterized by peeling off and removing a tape used to fix the parts, stacking an epoxy resin on the other side of the board, and proceeding with full pressing to fill the cavity with the epoxy resin while completely curing.