Method for silk screen printing onto a conductor made of two superposed layers

摘要

The method involves producing a set of test-patterns (5a-5d) on a surface (4) of a wafer (1) i.e. semiconductor wafer, and printing another set of test-patterns (6a-6d) that is distinct from the former set of test-patterns, during printing on the surface of the wafer by screen-printing. Actual distances (Ea-Ed) obtained on the surface of the wafer, between the corresponding test-patterns are measured. Each actual distance is compared with a theoretical distance so as to deduce the offset of a screen-printing screen. Independent claims are also included for the following: (1) a method for fabricating a photovoltaic cell (2) a screen printing device comprising an inspection unit constituted of a high-resolution camera and a computer.