ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

An objective of the present invention is to provide an electronic component capable of reducing a variation in height between conductive layers and obtaining flatness of the upper surface of the conductive patterns in the uppermost layer when the conductive pattern is laminated. The electronic component includes: a first conductive layer including a first conductive pattern (P1); a first insulating layer covering the first conductive layer; and a second conductive layer which is installed on the first insulating layer and a first opening (h1) passing through the first insulting layer to expose top and side surfaces of the first conductive pattern (P1) and includes a second conductive pattern (P2) connected to the first conductor pattern (P1) through the first opening (h1). A first opening region which is a planar region inside the first opening (h1) includes a first region in which the first conductor pattern (P1) is formed and a second region in which the first conductor pattern (P1) is not formed. The second conductor pattern (P2) is embedded on both the first and second regions of the first opening (h1).