Manufacturing method of semicondictor device and mounting jig

摘要

The method uses a mounting jig 10 having an insulated circuit board positioning jig 11, a tubular contact element positioning jig 12 having a plurality of positioning holes 121 formed at specified positions into each of which holes a tubular contact element 6 can be inserted and a tubular contact element press-down jig 13. By the insulated circuit board positioning jig 11 and tubular contact element positioning jig 12, an insulated circuit board 2 and the tubular contact elements 6 are made positioned and the tubular contact elements 6 are soldered to the insulated circuit board 2 while being pressed down by the tubular contact element press-down jig 13. This provides a manufacturing method of a semiconductor device which is capable of mounting the tubular contact elements onto the insulated circuit board with high positioning accuracy and a mounting jig which is preferably used for mounting the tubular contact elements on the insulated circuit board.