| 摘要 |
The disclosed content of the present specification relates to a chip package assembly which is electrically connected to a circuit board including multiple circuit board contact parts. The chip package assembly includes a chip package which communicates with a first side part and a second side part. The second side part includes multiple first contact parts which are electrically connected to the circuit board contact parts and multiple second contact parts which are electrically connected to a remote control device through a connector assembly. |
