| 摘要 |
A wafer 10 comprises mutually interconnected ridges 12 arranged to provide an array of recesses 14 suitable for receiving filling material; wherein ridges of a first plurality of aligned ridges extend in a first direction 16 traversing the wafer and are interrupted by recesses; and wherein ridges of a second plurality of aligned ridges extend in a second direction 18 traversing the wafer and are interrupted by recesses. Preferably the ridges are arranged in a hexagonal pattern. Such a pattern is intended to increase the strength of the wafer as there will be no direct path from one side of the wafer to another. In one embodiment, the interconnected ridges are non-rectilinear and in another they are configured such that for a majority of the wafer, any path across the wafer, and along one or more ridges, is an indirect path. |
