| 摘要 |
A module holder and heat sink, particularly for LED modules, comprising a module holder body which is adapted to be coupled to a heat sink with the interposition of a thermal interface material, the module holder being provided with holes for coupling to the heat sink, rivets being provided for insertion in the holes with the interposition of springs, elements being adapted to allow the coupling by interference of the module holder with the heat sink, such elements being adapted to enable the engagement of the rivets by way of the rotation or translational motion of the module holder with respect to the heat sink, without the use of fixing screws. |
