| 摘要 |
Provided by the present invention is a method for manufacturing a double-sided built-in type printed circuit board. The present invention: etches a carrier foil, a first copper foil, and a first insulating material one by one on one side of a core substrate on which the first copper foil and the carrier foil are covered on both sides across the first insulating material; forms a cavity which is formed on the first copper foil and the carrier foil on the opposite side as a bottom surface; settles a component on the bottom of the first copper foil of the opposite side by accommodating the component inside the cavity; and fixates the component by filling the inside of the cavity, in which the component is settled, with liquefied second insulating material and hardening the second insulating material. The present invention: removes the carrier foil; etches and removes the first copper foil after forming a via hole which connects the terminal of the component by etching the second insulating material; spreads a copper seed layer overall on an exposed surface by performing an electroless copper plating on a core substrate in which the component is embedded; and forms a second copper foil on both sides of the core substrate in order to fill the via hole by forming a plating mask on the copper seed layer and performing an electric copper plating. Lastly, the provided printed circuit board manufacturing method forms a circuit which connects a component terminal to the via hole in both sides of the core substrate by: etching and removing the exposed copper seed layer by peeling off and removing the plating mask and performing a flash etching; and spreading a solder-resist. |
