| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low modulus curable composition to be used for a sealing material for construction with little generation of a hazardous volatile substance, with little viscosity rise even in the case of storage of a base resin including a polymer in a high temperature and high humidity condition so as to be used for a long time, with little risk of pollution even if a paint is applied on its cured product, and with little risk of discoloration of the stone material even if it is used for a stone material so as to keep fine appearance over a long time. <P>SOLUTION: The multi-component curable composition comprises: a base resin including 100 pts.wt. of (A) an organic polymer having a triethoxysilyl group, 5 to 500 pts.wt. of (B) a filler, 10 to 400 pts.wt. of (C) a high molecular weight plasticizer having a number-average molecular weight of 1,000 to 15,000, and 2,000 ppm or more of a moisture content; and (D) a curing agent including 0.1 to 20 pts.wt. of a curing catalyst. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
