METHOD OF DESIGNING ARRANGEMENT OF TSV IN STACKED SEMICONDUCTOR DEVICE AND DESIGNING SYSTEM FOR ARRANGEMENT OF TSV IN STACKED SEMICONDUCTOR DEVICE

摘要

In a method of designing the arrangement of a TSV in a stacked semiconductor device, determined are TSV candidate grids which represent the insertable position of the TSVs by corresponding to semiconductor dies which are included in the stacked semiconductor device and are stacked with each other. Based on the TSV candidate grids, generated are path graphs which represent linkable signal paths with regard to signals which pass through the stacked semiconductor device. Based on the path graphs, initial TSV insertion positions are determined in order to correspond to the shortest signal paths with regard to the signals. Final insertion positions are determined in order to connect signal networks with regard to the signals by verifying the initial TSV insertion positions.