PACKAGE-ON-PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME

摘要

A package includes a package component. The package component further includes an upper surface and a metal pad on the upper surface of the package component. The package further includes a reflow-impossible electric connector bonded onto the metal pad, and a molding material on the package component. The reflow-impossible electric connector is molded with the molding material to touch the molding material. The reflow-impossible electric connector has an upper surface which is lower than the upper surface of a molding compound.