MEMORY CHIP PACKAGE, MEMORY SYSTEM HAVING THE SAME AND DRIVING METHOD THEREOF

摘要

A memory chip package according to the present invention includes memory chips of a stacked structure. The memory chips input/output an optical signal through an optical line having a via which penetrates the memory chips electrically connected to each other. The memory chips input/output optical signals of different wavelengths, respectively. The memory chips include a photoelectric converter, respectively, receive the optical signals of corresponding wavelengths, convert them into electric signals or receive electric signals and convert them into optical signals of corresponding wavelengths.