CHIP PACKAGE-IN-PACKAGE AND METHOD THEREOF

摘要

An electronic chip package comprises: an interposer; a die attached to a first side of the interposer; an embedded electronic package attached to a second side of the interposer; an encapsulation compound; a set of vias providing an electrical path from a first side of the electronic package to the interposer via the encapsulation compound; and a redistribution layer electrically redistributing the set of vias to form a set of interconnect-pads. Either the die or the embedded electronic package, or both are electrically connected to the interposer.