PACKAGES WITH MOLDING MATERIAL FORMING STEPS

摘要

A package includes a first package component having an upper surface, a second package component bonded to the upper surface of the first package component, and multiple electric connectors on the upper surface of the first package component. A molding material is on the first package component and is molded in the second package component. The molding material includes a first part which overlaps the second package component. The first part includes a first upper surface. The molding material further includes a second part which surrounds the first part and molds the lower parts of the electric connectors. The second part has a second upper surface which is lower than the first upper surface.