Through silicon via and method of forming the same

摘要

The present invention relates to a through silicon via (TSV). The TSV is disposed in a substrate including a via opening penetrating through a first surface and a second surface of the substrate. The TSV includes an insulation layer, a barrier layer, a buffer layer and a conductive electrode. The insulation layer is disposed on a surface of the via opening. The barrier layer is disposed on a surface of the insulation layer. The buffer layer is disposed on a surface of the barrier layer. The conductive electrode is disposed on a surface of the buffer layer and a remainder of the via opening is completely filled with the conductive electrode. A portion of the buffer layer further covers a surface of the conductive electrode at a side of the second surface and said portion is level with the second surface.

主权项

1. A through silicon via (TSV) disposed in a substrate having a via opening penetrating through a first surface and a second surface of the substrate, wherein the TSV comprises:
an insulation layer disposed on a surface of the via opening; a barrier layer disposed on a surface of the insulation layer, wherein the barrier layer comprises Ti/TiN or Ta/TaN; a buffer layer disposed on a surface of the barrier layer, wherein the buffer layer comprises tungsten; and a conductive electrode disposed on a surface of the buffer layer and a remainder of the via opening is completely filled with the conductive electrode, wherein a portion of the buffer layer further covers a surface of the conductive electrode at a side of the second surface and said portion is leveled with the second surface, wherein a material of the buffer layer is different from a material of the conductive electrode.