High density chip packages, methods of forming, and systems including same

摘要

Methods and devices for multi-chip stacks are shown. A method is shown that assembles multiple chips into stacks by stacking wafers prior to dicing into individual chips. Methods shown provide removal of defective chips and their replacement during the assembly process to improve manufacturing yield.

主权项

1. A method of forming a semiconductor structure, comprising:
attaching a first semiconductor wafer to a redistribution wafer; thinning a backside of the first semiconductor wafer to a first thickness to expose interconnection circuitry in a plurality of semiconductor chips included within the first semiconductor wafer; removing selected semiconductor chips from the surface of the first semiconductor wafer; and replacing the removed semiconductor chips with replacement semiconductor chips.