Liquid discharge head and method of producing liquid discharge head

摘要

A liquid discharge head includes an element substrate including an energy generating element; a supporting member adhesively supporting the element substrate; a sheet member adhesively bonded to the supporting member to adjoin the inner surface of an opening accommodating the element substrate in the sheet member and an end section of the element substrate; a wiring substrate bonded to the sheet member to adjoin the inner surface of an opening accommodating the element substrate in the wiring substrate and the end section of the element substrate and including a wire electrically connected to the energy generating element; and a sealant sealing a part electrical connecting the wiring substrate and element substrate, wherein the height of a wiring substrate surface opposite to that contacting the sheet member from supporting member is smaller than the element substrate surface opposite to that contacting the supporting member from the supporting member.

主权项

1. A liquid discharge head comprising:
an element substrate including an energy generating element for generating energy to be used to discharge liquid from a discharge port; a supporting member for supporting the element substrate, and bonded to the element substrate with a first adhesive; a sheet member having a first opening accommodating the element substrate and bonded to the supporting member with a second adhesive so as to adjoin the inner surface of the first opening and an end section of the element substrate; a wiring substrate having a second opening accommodating the element substrate, bonded to the sheet member with a third adhesive so as to adjoin an inner surface of the second opening and an end section of the element substrate, and including a wire electrically connected to the energy generating element; and a sealant for sealing an electrically connected part of the wiring substrate and the element substrate, wherein the sheet member is thicker than the wiring substrate, and wherein the height of a surface of the wiring substrate opposite to a surface contacting the sheet member with respect to the supporting member is smaller than the height of a surface of the element substrate opposite to a surface contacting the supporting member with respect to the supporting member, wherein a rigidity of the sheet member is greater than a rigidity of the wiring substrate thereby improving wiring connectivity during wire bonding, and wherein the second adhesive does not reach an upper surface of the wiring substrate, and wherein the bonding surface of the supporting member and the sheet member is disposed at a position lower than the position of the bonding surface of the supporting member and the element substrate.