Sensor module, sensor device, manufacturing method of sensor device, and electronic apparatus

摘要

A sensor module includes a support member having a first flat surface, a second flat surface orthogonally connected to the first flat surface, a third flat surface orthogonally connected to the first flat surface and the second flat surface, and a fourth flat surface opposed to the first flat surface as an attachment surface to an external member, the first flat surface having a support surface depressed from the first flat surface, IC chips having connection terminals on active surface sides with inactive surface sides along the active surfaces respectively attached to the respective surfaces of the support member, and vibration gyro elements having connection electrodes, and the vibration gyro elements are provided on the active surface sides of the IC chips and the connection electrodes are attached to the connection terminals of the IC chips so that principal surfaces are respectively along the respective surfaces of the support member.

主权项

1. A sensor module comprising:
a support member having a first support surface provided in parallel to a first reference plane within a depression and a second support surface in parallel to a second reference plane, the second reference plane being angled with respect to the first reference plane; a first IC chip attached to the first support surface and having a first connection terminal on one surface side, the other surface side along the one surface being an attachment surface to the first support surface; a second IC chip attached to the second support surface and having a second connection terminal on one surface side, the other surface side along the one surface being an attachment surface to the second support surface; a first sensor element provided above the one surface side of the first IC chip with a principal surface along the one surface and having a first connection electrode attached to the first connection terminal; and a second sensor element provided above the one surface side of the second IC chip with a principal surface along the one surface and having a second connection electrode attached to the second connection terminal.