| 摘要 |
Described is a bumpless build-up layer (BBUL) semiconductor package with an ultra-thin dielectric layer. For example, a device includes a semiconductor die which includes an integrated circuit having external conductive bumps. A semiconductor package receives the semiconductor die. The semiconductor package includes a dielectric layer arranged on the multiple external conductive bumps. A conductive via is arranged in the dielectric layer and is combined with one among the conductive bumps. A conductive line is arranged on the dielectric layer and is combined with the conducive via. |
