Backplane slot interconnection system, method and apparatus

摘要

Herein disclosed are an apparatus, a system and a method, selectively linking signals between or among slots on a backplane. A backplane printed circuit board has defined slots, each of which receives a card or module. One or more arrays of solder ball mounting pads correspond to signal lines of the slots. Each of one or more signal mapping overlay printed circuit boards has at least one signal trace connected to solder ball landing pads. Selected solder ball mounting pads of the backplane printed circuit board are connected to selected solder ball landing pads of the signal mapping overlay printed circuit board by solder balls. The signal trace or traces of the signal mapping overlay printed circuit board or boards connect the corresponding selected signal lines between or among the slots of the backplane. The backplane and signal mapping overlay printed circuit boards may have mirrored connection arrays.

主权项

1. A backplane apparatus comprising:
a backplane printed circuit board having a plurality of defined slots and signal lines therefrom connected to a first connection array; and at least one signal mapping overlay printed circuit board having signal paths connecting to a second connection array, with the first connection array and the second connection array forming one or more mirrored connection arrays supporting selectable location of a plurality of conductive interconnects that selectably connect signal lines from two or more of the slots via the signal paths of the signal mapping overlay printed circuit board, the signal paths of the at least one mapping overlay printed circuit board constructed with controlled electrical characteristics, including impedance, such that signal distortion is limited so as to keep signal quality intact throughout the respective connections.