发明名称 Oxide semiconductor thin-film transistor
摘要 A thin-film transistor includes a gate electrode, a source electrode, a drain electrode, a gate insulation layer and an oxide semiconductor pattern. The source and drain electrodes include a first metal element with a first oxide formation free energy. The oxide semiconductor pattern has a first surface making contact with the gate insulation layer and a second surface making contact with the source and drain electrodes to be positioned at an opposite side of the first surface. The oxide semiconductor pattern includes an added element having a second oxide formation free energy having an absolute value greater than or equal to an absolute value of the first oxide formation free energy, wherein an amount of the added element included in a portion near the first surface is zero or smaller than an amount of the added element included in a portion near the second surface.
申请公布号 US8841663(B2) 申请公布日期 2014.09.23
申请号 US201113080413 申请日期 2011.04.05
申请人 Samsung Display Co., Ltd. 发明人 Lee Je-Hun;Park Jae-Woo;Ahn Byung-Du;Park Sei-Yong;Park Jun-Hyun
分类号 H01L29/10;H01L29/12;H01L29/786;H01L29/45 主分类号 H01L29/10
代理机构 H.C. Park & Associates, PLC 代理人 H.C. Park & Associates, PLC
主权项 1. An oxide semiconductor thin-film transistor (TFT), comprising: a gate electrode disposed on a substrate; a source electrode and a drain electrode both comprising a first metal element with a first oxide formation free energy; a gate insulation layer insulating the gate electrode from the source electrode and the drain electrode; and an oxide semiconductor pattern comprising: a first surface contacting the gate insulation layer; and a second surface contacting the source electrode and the drain electrode, the second surface opposing the first surface, wherein the oxide semiconductor pattern entirely comprises an oxide material comprising an ion of at least one of indium (In), gallium (Ga), zinc (Zn), and tin (Sn), and further comprises an added element other than indium (In), gallium (Ga), zinc (Zn), and tin (Sn), with a second oxide formation free energy, the absolute value of the second oxide formation free energy being greater than or equal to the absolute value of the first oxide formation free energy, and wherein, in the oxide semiconductor pattern, an amount of the added element in a portion proximate to the first surface is zero or smaller than an amount of the added element in a portion proximate to the second surface.
地址 Yongin KR