发明名称 Method for producing semiconductor microparticles and the microparticles
摘要 It is an object to provide a method for producing compound semiconductor particles in which monodisperse compound semiconductor particles can be prepared according to the intended object, clogging with products does not occur due to self-dischargeability, a large pressure is not necessary, and productivity is high. In producing compound semiconductor particles by separating and precipitating, in a fluid, semiconductor raw materials, the fluid is formed into a thin film fluid between two processing surfaces arranged so as to be able to approach to and separate from each other, at least one of which rotates relative to the other, and the semiconductor raw materials are separated and precipitated in the thin film fluid. Further, in producing semiconductor microparticles containing semiconductor elements by reacting a compound containing semiconductor elements, in a fluid, with a reducing agent, the fluid is formed into a thin film fluid between two processing surfaces arranged so as to be able to approach to and separate from each other, at least one of which rotates relative to the other, and the compound containing semiconductor elements is reacted with the reducing agent in the thin film fluid.
申请公布号 US8841352(B2) 申请公布日期 2014.09.23
申请号 US200812672836 申请日期 2008.08.07
申请人 M Technique Co., Ltd. 发明人 Enomura Masakazu
分类号 B01F3/08;B01F7/00;C01G9/08;B82Y30/00;H01L21/02 主分类号 B01F3/08
代理机构 Birch, Stewart, Kolasch & Birch, LLP 代理人 Birch, Stewart, Kolasch & Birch, LLP
主权项 1. A method for producing semiconductor microparticles, comprising the steps of: providing a first fluid to be processed containing a raw material of semiconductor and a second fluid to be processed containing a reducing agent; introducing the first fluid and the second fluid to be processed into between two processing surfaces arranged to be capable of approaching to and separating from each other, at least one of which rotates relative to the other; forming a thin film fluid between the two processing surfaces; mixing the first fluid and the second fluid in the thin film fluid; and separating and precipitating semiconductor microparticles in the thin film fluid, wherein the raw material of semiconductor is a compound containing semiconductor elements, and the semiconductor microparticles are separated and precipitated in the thin film fluid by reacting the compound containing semiconductor elements with the reducing agent, thereby obtaining the semiconductor microparticles.
地址 Osaka JP