发明名称 Deposition method and method for manufacturing light-emitting device
摘要 An object is to provide a deposition method of forming a film in a minute pattern on a deposition target substrate as well as reducing waste of material and increasing material use efficiency. Another object is to manufacture a high-definition light-emitting device at low cost by such a deposition method. Particles containing an organic compound material are dispersed over a deposition substrate having a light-absorbing layer formed over the deposition substrate and are fixed by heat treatment to form a material layer. The light-absorbing layer is irradiated with light which is transmitted through the deposition substrate, so that a material contained in the material layer is selectively deposited onto a deposition target substrate placed facing the deposition substrate. By selective formation of the light-absorbing layer, a film can be selectively deposited in a minute pattern reflecting a pattern of the light-absorbing layer onto the deposition target substrate.
申请公布号 US8840972(B2) 申请公布日期 2014.09.23
申请号 US200912396636 申请日期 2009.03.03
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Yamazaki Shunpei
分类号 B05D3/00;C08J7/18;C23C14/30;C23C14/04;C23C14/28 主分类号 B05D3/00
代理机构 Husch Blackwell LLP 代理人 Husch Blackwell LLP
主权项 1. A deposition method comprising the steps of: selectively forming a light-absorbing layer having a pattern over a first substrate; dispersing particles containing an organic compound material over and in contact with the first substrate and the light-absorbing layer having the pattern; fixing the particles at least onto the light-absorbing layer having the pattern by heat treatment; disposing the first substrate and a second substrate so that a surface of the first substrate over which the light-absorbing layer having the pattern is formed and a deposition target surface of the second substrate face each other; and irradiating the light-absorbing layer having the pattern with light which is transmitted through the first substrate so that the organic compound material is deposited onto the deposition target surface of the second substrate.
地址 JP