System and method for reducing temperature variation during burn in

摘要

Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

主权项

1. A method comprising:
applying a range of body bias voltage values to a first integrated circuit to reduce a leakage current of the first integrated circuit to an acceptable value, wherein the first integrated circuit includes a plurality of devices; responsive to the leakage current of the first integrated circuit decreasing to the acceptable value, identifying a body bias voltage value applied to the first integrated circuit by the applying the range of body bias voltage values; and performing burn-in testing of a second integrated circuit, wherein said performing burn-in testing includes:
applying the body bias voltage value to the second integrated circuit; andadjusting the body bias voltage value to obtain an acceptable junction temperature for the second integrated circuit in response to a calculation that involves a power measurement, an ambient temperature measurement, and a thermal resistance value.