Stacked semiconductor device and method of manufacturing the same

摘要

A stacked semiconductor device includes a unit component including a wiring portion formed by electrically connecting a die pad of and a lead of a lead frame, and a semiconductor package whose connection terminal is connected to the lead, wherein the unit component is stacked, and the leads located to upper and lower sides are connected mutually via an electrode.

主权项

1. A stacked semiconductor device, comprising:
a plurality of unit components, each unit component including: a wiring portion formed by electrically connecting a die pad and a lead of a lead frame, and a semiconductor package having a connection terminal connected to the lead; wherein the plurality of unit components is stacked, and the lead in each unit component is connected mutually to the lead in an adjacent unit component via an electrode.