发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
In one embodiment, a semiconductor device includes a first diffusion layer of a first conductivity type and a second diffusion layer of a second conductivity type that are provided in a semiconductor layer at a distance, the second conductivity type being an opposite conductivity type of the first conductivity type, a first insulating film and a second insulating film that are provided on the semiconductor layer between the first diffusion layer and the second diffusion layer at a distance, a gate electrode provided on the first insulating film, and a threshold regulating electrode provided on the second insulating film. |
申请公布号 |
US8841728(B2) |
申请公布日期 |
2014.09.23 |
申请号 |
US201313919927 |
申请日期 |
2013.06.17 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Kondo Yoshiyuki;Hokazono Akira |
分类号 |
H01L29/76;H01L21/28;H01L29/78 |
主分类号 |
H01L29/76 |
代理机构 |
Holtz Holtz Goodman & Chick PC |
代理人 |
Holtz Holtz Goodman & Chick PC |
主权项 |
1. A semiconductor device comprising:
a first diffusion layer of a first conductivity type and a second diffusion layer of a second conductivity type that are provided in a semiconductor layer at a distance, the second conductivity type being an opposite conductivity type of the first conductivity type; a first insulating film and a second insulating film that are provided on the semiconductor layer between the first diffusion layer and the second diffusion layer at a distance; a gate electrode provided on the first insulating film; and a threshold regulating electrode provided on the second insulating film; wherein an extension region of the first conductivity type is provided adjacent to the first diffusion layer; and wherein a pocket region of the second conductivity type is provided adjacent to the first diffusion layer on a surface of the semiconductor layer, and the extension region covers at least a part of the pocket region. |
地址 |
Tokyo JP |