发明名称 Semiconductor device and method of manufacturing the same
摘要 In one embodiment, a semiconductor device includes a first diffusion layer of a first conductivity type and a second diffusion layer of a second conductivity type that are provided in a semiconductor layer at a distance, the second conductivity type being an opposite conductivity type of the first conductivity type, a first insulating film and a second insulating film that are provided on the semiconductor layer between the first diffusion layer and the second diffusion layer at a distance, a gate electrode provided on the first insulating film, and a threshold regulating electrode provided on the second insulating film.
申请公布号 US8841728(B2) 申请公布日期 2014.09.23
申请号 US201313919927 申请日期 2013.06.17
申请人 Kabushiki Kaisha Toshiba 发明人 Kondo Yoshiyuki;Hokazono Akira
分类号 H01L29/76;H01L21/28;H01L29/78 主分类号 H01L29/76
代理机构 Holtz Holtz Goodman & Chick PC 代理人 Holtz Holtz Goodman & Chick PC
主权项 1. A semiconductor device comprising: a first diffusion layer of a first conductivity type and a second diffusion layer of a second conductivity type that are provided in a semiconductor layer at a distance, the second conductivity type being an opposite conductivity type of the first conductivity type; a first insulating film and a second insulating film that are provided on the semiconductor layer between the first diffusion layer and the second diffusion layer at a distance; a gate electrode provided on the first insulating film; and a threshold regulating electrode provided on the second insulating film; wherein an extension region of the first conductivity type is provided adjacent to the first diffusion layer; and wherein a pocket region of the second conductivity type is provided adjacent to the first diffusion layer on a surface of the semiconductor layer, and the extension region covers at least a part of the pocket region.
地址 Tokyo JP