发明名称 |
Method of forming vertical electronic fuse interconnect structures including a conductive cap |
摘要 |
An electronic fuse structure including a first Mx metal comprising a conductive cap, an Mx+1 metal located above the Mx metal, wherein the Mx+1 metal does not comprise a conductive cap, and a via, wherein the via electrically connects the Mx metal to the Mx+1 metal in a vertical orientation. |
申请公布号 |
US8841208(B2) |
申请公布日期 |
2014.09.23 |
申请号 |
US201213552106 |
申请日期 |
2012.07.18 |
申请人 |
International Business Machines Corporation |
发明人 |
Bao Junjing;Huang Elbert Emin;Li Yan Zun;Moy Dan |
分类号 |
H01L21/44;H01L21/82;H01L23/52 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
Kelly L. Jeffrey;Ivers Catherine |
主权项 |
1. A method of forming an electronic fuse, the method comprising:
providing an Mx level comprising a first Mx metal and a second Mx metal; forming a conductive cap directly on top of the second Mx metal, and no conductive cap being formed directly on top of the first Mx metal; depositing an Mx cap dielectric above and in direct contact with the first Mx metal, and above the second Mx metal in direct contact with the conductive cap; forming an Mx+1 level above the Mx level, the Mx+1 level comprising an Mx+1 metal; and forming a via electrically connecting the second Mx metal to the Mx+1 metal in a vertical orientation. |
地址 |
Armonk NY US |