发明名称 Method of forming vertical electronic fuse interconnect structures including a conductive cap
摘要 An electronic fuse structure including a first Mx metal comprising a conductive cap, an Mx+1 metal located above the Mx metal, wherein the Mx+1 metal does not comprise a conductive cap, and a via, wherein the via electrically connects the Mx metal to the Mx+1 metal in a vertical orientation.
申请公布号 US8841208(B2) 申请公布日期 2014.09.23
申请号 US201213552106 申请日期 2012.07.18
申请人 International Business Machines Corporation 发明人 Bao Junjing;Huang Elbert Emin;Li Yan Zun;Moy Dan
分类号 H01L21/44;H01L21/82;H01L23/52 主分类号 H01L21/44
代理机构 代理人 Kelly L. Jeffrey;Ivers Catherine
主权项 1. A method of forming an electronic fuse, the method comprising: providing an Mx level comprising a first Mx metal and a second Mx metal; forming a conductive cap directly on top of the second Mx metal, and no conductive cap being formed directly on top of the first Mx metal; depositing an Mx cap dielectric above and in direct contact with the first Mx metal, and above the second Mx metal in direct contact with the conductive cap; forming an Mx+1 level above the Mx level, the Mx+1 level comprising an Mx+1 metal; and forming a via electrically connecting the second Mx metal to the Mx+1 metal in a vertical orientation.
地址 Armonk NY US
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