Manufacturing method of semiconductor device, and semiconductor device

摘要

Provided is a resin sealed semiconductor device with improved reliability. After positioning a cap (lid) so as to cover semiconductor chips and wires, resin is supplied into a space formed by the cap, so that a sealing body is formed to cover the semiconductor chips and the wires. In the step of forming the sealing body, the resin is supplied from an opening formed at a corner of the cap in the planar view. The sealing body is exposed at the corner of the cap, so that the exposed part of the sealing body can be kept away from the wires.

主权项

1. A manufacturing method of a semiconductor device, comprising the steps of:
(a) providing a lead frame having a chip mounting portion and a plurality of leads arranged around the chip mounting portion; (b) after the step (a), mounting a semiconductor chip over the chip mounting portion, said semiconductor chip having a front surface, a plurality of electrodes formed over the front surface, and a back surface opposite to the front surface; (c) after the step (b), electrically connecting the leads with the electrodes of the semiconductor chip via a plurality of wires; (d) after the step (c), arranging a lid so as to cover the semiconductor chip and the wires, and bonding the lid to the leads by a sealant; and (e) after the step (d), supplying resin into a space inside the lid with the semiconductor chip arranged therein, thereby sealing the wires and the semiconductor chip with the resin, wherein a shape in a plan view of the lid is comprised of a quadrangle having a first corner, wherein in the step (d), a gap between adjacent ones of the leads is filled with a part of the sealant, and wherein in the step (e), the resin is supplied into the space from the first corner not filled with the sealant.