Integrated circuit package system with mold gate

摘要

An integrated circuit package system includes: providing a substrate; forming a conductive layer over the substrate; forming a mold gate layer having an organic material without polymerization over the conductive layer; and attaching an integrated circuit over the substrate adjacent the mold gate layer.

主权项

1. A method for manufacturing an integrated circuit package system comprising:
providing a substrate; forming a conductive layer over the substrate; forming a mold gate layer having an organic material without polymerization in direct contact with a top surface of the conductive layer; attaching an integrated circuit over the substrate adjacent the mold gate layer; and forming an encapsulant over the integrated circuit, the conductive layer, and the mold gate layer, a portion of a top surface of the mold gate layer exposed from the encapsulant.