发明名称 |
Semiconductor structure and method for slimming spacer |
摘要 |
A semiconductor structure including a substrate and a gate structure disposed on the substrate is disclosed. The gate structure includes a gate dielectric layer disposed on the substrate, a gate material layer disposed on the gate dielectric layer and an outer spacer with a rectangular cross section. The top surface of the outer spacer is lower than the top surface of the gate material layer. |
申请公布号 |
US8841193(B2) |
申请公布日期 |
2014.09.23 |
申请号 |
US201313928366 |
申请日期 |
2013.06.26 |
申请人 |
United Microelectronics Corp. |
发明人 |
Guo Ted Ming-Lang;Chien Chin-Cheng;Chan Shu-Yen;Chou Ling-Chun;Chang Tsung-Hung;Wu Chun-Yuan |
分类号 |
H01L21/336;H01L29/78;H01L29/66 |
主分类号 |
H01L21/336 |
代理机构 |
|
代理人 |
Hsu Winston;Margo Scott |
主权项 |
1. A method for lowering the height of a spacer, comprising:
providing a gate structure disposed on a substrate, said gate structure comprising:
a gate dielectric layer disposed on said substrate;a gate material layer disposed on said gate dielectric layer; andan outer spacer with a sail-like cross section and adjacent to said gate dielectric layer and said gate material layer; and performing an oxidative slimming procedure to slim the height of said outer spacer without substantially slimming the width of said outer spacer to make said outer spacer have a rectangular cross section, wherein the width of said rectangular cross section is larger than the height of said rectangular cross section. |
地址 |
Science-Based Industrial Park, Hsin-Chu TW |