发明名称 Semiconductor structure and method for slimming spacer
摘要 A semiconductor structure including a substrate and a gate structure disposed on the substrate is disclosed. The gate structure includes a gate dielectric layer disposed on the substrate, a gate material layer disposed on the gate dielectric layer and an outer spacer with a rectangular cross section. The top surface of the outer spacer is lower than the top surface of the gate material layer.
申请公布号 US8841193(B2) 申请公布日期 2014.09.23
申请号 US201313928366 申请日期 2013.06.26
申请人 United Microelectronics Corp. 发明人 Guo Ted Ming-Lang;Chien Chin-Cheng;Chan Shu-Yen;Chou Ling-Chun;Chang Tsung-Hung;Wu Chun-Yuan
分类号 H01L21/336;H01L29/78;H01L29/66 主分类号 H01L21/336
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. A method for lowering the height of a spacer, comprising: providing a gate structure disposed on a substrate, said gate structure comprising: a gate dielectric layer disposed on said substrate;a gate material layer disposed on said gate dielectric layer; andan outer spacer with a sail-like cross section and adjacent to said gate dielectric layer and said gate material layer; and performing an oxidative slimming procedure to slim the height of said outer spacer without substantially slimming the width of said outer spacer to make said outer spacer have a rectangular cross section, wherein the width of said rectangular cross section is larger than the height of said rectangular cross section.
地址 Science-Based Industrial Park, Hsin-Chu TW