Preparation of metallurgic network compositions and methods of use thereof

摘要

The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.

主权项

1. A particle mixture composition comprising:
a) between about 35 mass % and about 60 mass % of a first metallic particle component comprising a first metal, based on the total mass of metal particles in the composition; b) a second metallic particle component comprising a second metal that forms intermetallic species with the first metal at temperature T1, wherein the intermetallic species have a minimum melting temperature not less than 10° C. above T1, wherein:
i) the second metallic particle component comprises an excess of the second metal over the amount required to completely convert all of the first metal to the intermetallic species, andii) the second metallic particle component comprises at least about 10 mass % of a first alloy of the second metal and a carrier, that is molten at T1 wherein heating the particle mixture to T1 produces reaction products comprising:
(1) at least 75 mass % of a thermally stable component that does not melt below 300° C.; and (2) at least 5 mass % of a remelting component dispersed throughout the thermally stable component, that remelts at a temperature T2, wherein remelting T2 is below 220° C., wherein remelting occurs with consistent energy throughout multiple exposures to a temperature between T2 and 300° C.