| 摘要 |
PROBLEM TO BE SOLVED: To provide a simulation analyzer which can perform simulation analysis on a crack generated in a joint body.SOLUTION: A simulation analyzer 100 formed by laminating a first member surface-joined to a top face of a joint body and a second member surface-jointed to a bottom surface of the joint body, in a direction perpendicular to a joint surface, to perform structural analysis of a semiconductor package sealed in sealant includes: a simulation execution unit 12 which reads physical property value information, dimension information, and shape information of the first and second members and the joint body, to calculate maximum principal stress to be applied to the joint body when heated at a predetermined temperature; and a displacement amount calculation unit 14 which calculates an amount of displacement in a direction perpendicular to the joint surface, generated in the joint body when heated up to the predetermined temperature; and evaluation units 13, 15 which evaluate that no crack is generated in the joint body when the maximum principal stress is equal to or less a first threshold and the amount of displacement is equal to or less than a second threshold. |
