| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier-fitted copper foil having a favorable peel strength and suited for forming fine pitches and a method for manufacturing a printed wiring board.SOLUTION: The provided carrier-fitted copper foil is a carrier-fitted copper foil furnished with a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrafine copper layer laminated on the intermediate layer wherein the intermediate layer includes, as an oxide having a spinel-type crystal structure, an oxide including an electroconductive oxide; a method for manufacturing a printed wiring board wherein a copper-clad laminate sheet is formed past a step of preparing the carrier-fitted copper foil and an insulating substrate, a step of laminating the carrier-fitted copper foil and insulating substrate, and a step of peeling, following the lamination of the carrier-fitted copper foil and insulating substrate, the carrier of the carrier-fitted copper foil and wherein a circuit is formed based on any method selected from among the semi-additive method, subtractive method, partly additive method, and modified semi-additive method is also provided. |
