| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to perform the dielectric strength test of a semiconductor device in which conductive components including a part of leads and a semiconductor element electrically connected thereto are encapsulated in tabular mold resin, the remaining leads are projected from the side surface of the mold resin, and through holes are formed that penetrate the mold resin in a plate thickness direction.SOLUTION: A dielectric strength tester 1 includes a mold side electrode part 2 made to come into contact with mold resin 113, a lead side electrode part 3 made to come into contact with a lead 112 projected from the mold resin 113, and a power source 4 for applying a voltage between the mold side electrode part 2 and lead side electrode part 3. The mold side electrode part 2 has electrode pins 15 inserted into the through holes 116 of the mold resin 113. |
