| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting substrate capable of sufficiently extracting the performance of a semiconductor light emitting element such as an LED element.SOLUTION: A mounting substrate 1 on which an LED chip 4 is mounted includes: a pair of lead frames 2 (a first lead part 2a and a second lead part 2b) having connection surfaces connected to one of a positive electrode terminal and a negative electrode terminal of the LED chip 4, respectively, and supplying power to the LED chip 4; a resin-made body 3 supporting the pair of lead frames 2 while at least a part of each connection surface is exposed and formed so as to electrically separate the pair of lead frames 2 each other. Exposed portions 21a, 21b exposed on each connection surface include a power feeding part for feeding power supplied to the LED chip 4. |
