发明名称 |
IMPURITY THERMAL DIFFUSION TREATMENT PROCESS OF SEMICONDUCTOR WAFER |
摘要 |
PROBLEM TO BE SOLVED: To provide an impurity thermal diffusion treatment process arranged to suppress the diffusion of an impurity into a portion other than a surface layer to diffuse the impurity into in performing a thermal diffusion of the impurity into the outermost surface of a semiconductor wafer.SOLUTION: An impurity thermal diffusion treatment process of a semiconductor wafer is a process for performing a thermal diffusion of an impurity into a surface layer ranging to a depth of 10 μm from a surface of the semiconductor wafer. The process comprises the step of applying silica sol to a surface of the semiconductor wafer on the side opposite to a surface to diffuse the impurity into, thereby suppressing thermal diffusion of the impurity into a portion other than the surface layer. |
申请公布号 |
JP2014175490(A) |
申请公布日期 |
2014.09.22 |
申请号 |
JP20130047162 |
申请日期 |
2013.03.08 |
申请人 |
NISSAN CHEM IND LTD;HYOGO PREFECTURE |
发明人 |
ITO SHOGO;FUKATSU TAKESHI;TANIMOTO KENJI;KIMURA YUTAKA |
分类号 |
H01L21/22;H01L21/225;H01L31/04 |
主分类号 |
H01L21/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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