发明名称 IMPURITY THERMAL DIFFUSION TREATMENT PROCESS OF SEMICONDUCTOR WAFER
摘要 PROBLEM TO BE SOLVED: To provide an impurity thermal diffusion treatment process arranged to suppress the diffusion of an impurity into a portion other than a surface layer to diffuse the impurity into in performing a thermal diffusion of the impurity into the outermost surface of a semiconductor wafer.SOLUTION: An impurity thermal diffusion treatment process of a semiconductor wafer is a process for performing a thermal diffusion of an impurity into a surface layer ranging to a depth of 10 μm from a surface of the semiconductor wafer. The process comprises the step of applying silica sol to a surface of the semiconductor wafer on the side opposite to a surface to diffuse the impurity into, thereby suppressing thermal diffusion of the impurity into a portion other than the surface layer.
申请公布号 JP2014175490(A) 申请公布日期 2014.09.22
申请号 JP20130047162 申请日期 2013.03.08
申请人 NISSAN CHEM IND LTD;HYOGO PREFECTURE 发明人 ITO SHOGO;FUKATSU TAKESHI;TANIMOTO KENJI;KIMURA YUTAKA
分类号 H01L21/22;H01L21/225;H01L31/04 主分类号 H01L21/22
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