| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a plurality of substrates for power module efficiently, by preventing deviation of positioning of a ceramic plate, a bonding material and a copper circuit plate, when bonding the copper circuit plate to the ceramic plate by active material brazing method.SOLUTION: Provided is a method of manufacturing a plurality of substrates for power module by bonding a plurality of copper circuit plates 30, while spacing from each other, to a ceramic plate 21 having an area in which a plurality of ceramic substrates can be formed side by side, and then dividing the ceramic plate 21 between these copper circuit plates 30. The method includes: forming, on the ceramic plate 21, a bonding material layer 71 composed of an active metal brazing material having the same outer shape as that of the copper circuit plate 30; coating the copper circuit plate 30 with a tacking material 72 mainly composed of polyethylene glycol; tacking the bonding material layer 71 and copper circuit plate 30 onto the ceramic plate 21 by the tacking material 72, while aligning in laminated state; and pressing the laminate in the lamination direction and heating the laminate to bond the ceramic plate and the copper circuit plate. |
