| 摘要 |
PROBLEM TO BE SOLVED: To provide heat treatment equipment capable of improving evenness of in-plane temperature distribution of a substrate at the time of illuminating light and heating, and a heat treatment method.SOLUTION: Four wafer pins 12 are fixedly installed at intervals of 90° in a chamber. Four support pins 72 are arranged at intervals of 90° in a wafer pocket 71 of a susceptor. Four wafer pins 12 and four support pins 72 are alternately arranged at intervals of 45° along the same circumference. When the illuminating light and heating of the semiconductor wafer is performed by a halogen lamp, change of a holding position by wafer pins 12 and support pins 72 on the semiconductor wafer is performed by moving up and down the susceptor. By preventing quartz pins with a relatively low temperature from continuing to contact with a certain part of the semiconductor wafer, evenness of in-plane temperature distribution of the semiconductor wafer can be improved. |
