发明名称 |
ELECTRO-PLATING AND APPARATUS FOR PERFORMING THE SAME |
摘要 |
According to the present invention, a method for plating a metal layer on a work piece includes the steps of: exposing a plating solution the surface of the work piece to a plating solution; and providing a first voltage of a negative terminal of a power source to an edge part of the work piece. A second voltage is provided to an inner side of the work piece. The inner side is closer to the center of the work piece than the edge part is. A positive terminal is connected to a metal plate. The metal plate and the work piece are separated from each other by the plating solution and contact the plating solution. |
申请公布号 |
KR20140111925(A) |
申请公布日期 |
2014.09.22 |
申请号 |
KR20130115821 |
申请日期 |
2013.09.30 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
KAO CHEN YUAN;SU HUNG WEN;TSAI MINGHSING |
分类号 |
C25D7/12;C25D17/00;C25D21/12 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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