发明名称 ELECTRO-PLATING AND APPARATUS FOR PERFORMING THE SAME
摘要 According to the present invention, a method for plating a metal layer on a work piece includes the steps of: exposing a plating solution the surface of the work piece to a plating solution; and providing a first voltage of a negative terminal of a power source to an edge part of the work piece. A second voltage is provided to an inner side of the work piece. The inner side is closer to the center of the work piece than the edge part is. A positive terminal is connected to a metal plate. The metal plate and the work piece are separated from each other by the plating solution and contact the plating solution.
申请公布号 KR20140111925(A) 申请公布日期 2014.09.22
申请号 KR20130115821 申请日期 2013.09.30
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 KAO CHEN YUAN;SU HUNG WEN;TSAI MINGHSING
分类号 C25D7/12;C25D17/00;C25D21/12 主分类号 C25D7/12
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