| 摘要 |
PROBLEM TO BE SOLVED: To efficiently remove various contamination adhered on a circuit element by utilizing plasma.SOLUTION: A plasma cleaning method includes: a process of carrying a circuit element with contamination adhered in a treatment space; a process of introducing gas in the treatment space; a process of generating a high-frequency electric field and generating plasma of the gas in the treatment space; and a process of cleaning the circuit element with the contamination adhered by the plasma. The process of introducing the gas includes (i) a first process of introducing argon and fluorocarbon in the treatment space, and (ii) a second process of continuously introducing the argon but not introducing the fluorocarbon in the treatment space. The process of cleaning the circuit element includes (i) first treatment of cleaning the circuit element by the plasma of mixed gas of the argon and the fluorocarbon in the first process; and (ii) second treatment of cleaning the circuit element and the treatment space by plasma of the argon in the second process. |
