| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which deals with heavy-current and achieves excellent heat radiation performance.SOLUTION: A plate-like connection plate 23 which widely spreads so as to cover one surface 22a of a semiconductor element 22 is used for connection between leads 26a, 26b with an electrode 29a of the semiconductor element 22. Use of the plate-like connection plate 23 overlapping with the one surface 22a of the semiconductor element 22 and having a large surface area enables heat generated in the connection plate 23 to be efficiently radiated to the exterior through a sealing resin 27. |
