发明名称 PEELING DEVICE, PEELING SYSTEM, AND PEELING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To increase efficiency of peeling processing.SOLUTION: A peeling device according to an embodiment includes a holding part, a plurality of suction and moving parts, a state detection part, and a control part. The holding part holds a first substrate of a superposed substrate where the first substrate and a second substrate are bonded together. The plurality of suction and moving parts suction the second substrate of the superposed substrate and move the second substrate in a direction in which the second substrate is separated from a plate surface of the first substrate. The state detection part detects a state of peeling of the second substrate from the first substrate. The control part controls, based on the peeling state detected by the state detection part, an operation timing of the plurality of suction and moving parts so that the second substrate gradually peels from the first substrate in a direction from one end of the second substrate to the other end.</p>
申请公布号 JP2014175420(A) 申请公布日期 2014.09.22
申请号 JP20130045969 申请日期 2013.03.07
申请人 TOKYO ELECTRON LTD 发明人 DEGUCHI MASATOSHI;SAKAGAMI TAKASHI;TASHIRO KEI;ITO MASANORI
分类号 H01L21/683;H01L21/02;H01L21/304 主分类号 H01L21/683
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