| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device that allows easily and stably fixing a semiconductor module and ensuring cooling capability of the semiconductor module.SOLUTION: A power conversion device 1 has a semiconductor module 11, a cooler 2, and a pressing member 3. The cooler 2 has a cooling tube 21, a pair of pipes 221 and 222, and a connection portion 25 connecting the cooling tube 21 and the pair of pipes 221 and 222. The pressing member 3 has a module contact surface 31 and a pipe contact portion 32. The pair of pipes 221 and 222 are disposed on a cooling surface 211 side of the cooling tube 21. The connection portion 25 is configured to be deformable in a normal direction Z, and is provided between the cooling tube 21 and the pipes 221 and 222. In the power conversion device 1, the pipe contact portion 32 is in contact with the pair of pipes 221 and 222, and the connection portion 25 is deformed in the normal direction Z. |
